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Key Benifits

Enables extreme Lightly Doped Emitters (LDE) 

Improved Printability

Wider firing window 

Lower cost

Better contact with silicon wafer

Wide process window

Compatible for PERC process

Cd free

固含量Solids(%)

90-92

粘度Viscosity (Pa·s)

 

230-350

细度Fineness of grindμm

 

<5

烘干Drying

 

180–250°C, <3 minutes

烧结Firing

 

750–800°C, <5 seconds

细栅高宽比Finger aspect ratio

 

>0.3

焊接所用焊带Ribbon of soldering

 

60Sn/40Pb, 96.5Sn/3.5Agetc.

保质期(月,5-25°C)Storage(months)

 

6

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