Key
Benifits
Enables extreme Lightly Doped Emitters (LDE)
Improved Printability
Wider firing window
Lower cost
Better contact with silicon wafer
Wide process window
Compatible for PERC process
Cd free
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固含量Solids(%)
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90-92
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粘度Viscosity (Pa·s)
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230-350
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细度Fineness of grind（μm）
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<5
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烘干Drying
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180–250°C, <3 minutes
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烧结Firing
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750–800°C, <5 seconds
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细栅高宽比Finger aspect ratio
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>0.3
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焊接所用焊带Ribbon of soldering
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60Sn/40Pb, 96.5Sn/3.5Ag，etc.
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保质期(月，5-25°C)Storage(months)
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|
6
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