Key Benifits Enables extreme Lightly Doped Emitters (LDE) Improved Printability Wider firing window Lower cost Better contact with silicon wafer Wide process window Compatible for PERC process Cd free
Typical Properties
固含量Solids(%)
90-92
粘度Viscosity (Pa·s)
230-350
细度Fineness of grind（μm）
<5
烘干Drying
180–250°C, <3 minutes
烧结Firing
750–800°C, <5 seconds
细栅高宽比Finger aspect ratio
>0.3
焊接所用焊带Ribbon of soldering
60Sn/40Pb, 96.5Sn/3.5Ag，etc.
保质期(月，5-25°C)Storage(months)
6
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